Eliyan Reaches $1 Billion Valuation With $145 Million Series C
The Santa Clara startup is building chiplet and licensing technology designed to move data faster between AI processors, memory and networking systems.

SANTA CLARA, Calif. - Eliyan has raised $145 million in Series C financing at a $1 billion valuation, giving the interconnect startup fresh capital to attack one of AI computing's most expensive constraints: moving data fast enough to keep processors busy. The investment marks a significant milestone for the Santa Clara-based firm, elevating it to unicorn status at a time when the semiconductor industry is racing to solve the throughput bottlenecks that threaten to stall the progress of large-scale generative artificial intelligence models. As the computational demands of these models grow exponentially, the fundamental physical limits of moving electrons across silicon and circuit boards have emerged as a primary concern for the world's largest data center operators.
Seligman Ventures led the round, signaling strong institutional confidence in Eliyan’s technical approach to chiplet-based architectures. The financing attracted a strategic mix of participants, including Cisco Investments and optical networking company Lumentum, which joined alongside a group of existing and new backers. The inclusion of Cisco and Lumentum is particularly notable, as both companies occupy critical positions within the global networking and fiber-optic infrastructure supply chains. Their participation suggests that Eliyan’s technology is viewed not just as a niche semiconductor play, but as a foundational component for the next generation of high-speed digital communication.
In conjunction with the funding, Umesh Padval, managing partner at Seligman Ventures, will join Eliyan's board of directors. Padval brings a deep pedigree in the high-speed connectivity sector, having served as an early investor and board member at Mellanox, the interconnect pioneer eventually acquired by Nvidia for $6.9 billion. His appointment reflects the high stakes involved in the interconnect market, where the ability to efficiently link graphics processing units and specialized accelerators can make the difference between a high-performing cluster and a fragmented, underutilized data center environment.
The core problem Eliyan aims to solve involves the widening performance gap in modern AI accelerators. While companies like Nvidia and AMD have produced chips capable of performing trillions of operations per second, the surrounding infrastructure often struggles to deliver data at a commensurate speed. This imbalance, often referred to as the memory wall or the interconnect bottleneck, can leave these multi-thousand-dollar processors idling while they wait for information to arrive from memory or other nodes. Eliyan is developing a vendor-independent approach that includes licensable interconnect technology and chiplets, modular components that customers can add to custom AI processors to streamline these pathways.
Chiplets represent a major architectural shift in the semiconductor industry, moving away from monolithic designs where all functions are integrated into a single piece of silicon. By utilizing chiplets, designers can mix and match various components—such as CPU cores, specialized AI engines, and high-speed interfaces—on a single package. Eliyan’s strategy focuses on providing the 'glue' that allows these disparate pieces to communicate at speeds necessary for real-time AI training and inference. This modularity allows for greater design flexibility and can improve manufacturing yields, as smaller chips are generally easier and cheaper to produce than massive, single-die processors.
Beyond its current focus on electrical connectivity, Eliyan is planning an aggressive expansion into electro-optical links. This evolution is becoming critical as AI clusters expand into massive formations involving tens of thousands of processors. As the physical distance between components increases, traditional copper-based electrical signals encounter significant degradation and power loss. Optical interconnects, which move data via light, offer a way to maintain high throughput over longer distances while consuming less energy. The presence of Lumentum in this funding round underscores the strategic necessity of bridging the gap between traditional silicon hardware and advanced photonics.
The strategic relevance of Cisco and Lumentum cannot be overstated in the context of the current hardware land grab. Cisco, a dominant force in data center switching and networking, has a vested interest in any technology that enhances the efficiency of data movement between nodes. Lumentum, meanwhile, provides the laser and optical components that are increasingly integrated directly into chip packages. For Eliyan, these partnerships provide more than just capital; they offer a potential roadmap for integration into the broader ecosystem of networking equipment and service provider infrastructure that underpins the public cloud.
Eliyan expects initial chiplet shipments to commence in 2026, a timeline that places them in direct competition with internal efforts from major hyperscalers and established semiconductor giants. The company’s executives have set an ambitious growth trajectory, telling Reuters they are targeting revenue in the hundreds of millions of dollars by the end of 2027. This represents a massive projected increase from revenues in the low millions anticipated for 2025. Such a ramp-up suggests a high level of confidence in the design-win cycle currently underway within the industry.
Achieving these revenue targets will require a flawless execution of the company’s roadmap. The semiconductor industry is notoriously capital-intensive and fraught with technical hurdles, particularly when transitioning from design to mass production. Eliyan will need to secure significant design wins with major chip designers and cloud service providers, many of whom are already experimenting with their own proprietary interconnect standards. Furthermore, manufacturing execution at scale remains a hurdle, as the company must ensure its chiplets can be reliably integrated into complex manufacturing processes at foundries and packaging facilities.
The competitive landscape for interconnects is also intensifying. Established players and a wave of venture-backed startups are all vying to become the standard for the next era of AI hardware. The success of Eliyan’s vendor-independent approach relies on the willingness of the broader industry to adopt open or interoperable standards rather than coalescing around closed ecosystems. However, the $1 billion valuation suggests that the market sees a high probability that the industry will remain fragmented enough to require a neutral, high-performance connectivity provider.
Customer validation will be the ultimate metric for Eliyan in the coming years. While the Series C round provides a substantial financial cushion, the company must demonstrate that its technology can perform at scale in the rigorous environments of enterprise data centers. The transition from electrical to optical signaling, in particular, will be a closely watched phase of the company’s development, as it represents the leading edge of high-performance computing research and development.
Ultimately, this funding round shows that investors increasingly view interconnects as a core part of the AI hardware stack, rather than a secondary or peripheral component. The focus of the industry has shifted from merely increasing the raw power of individual chips to optimizing the entire system-level architecture. If Eliyan can successfully bridge the gap between processors, memory, and networking, it could become an indispensable architect of the infrastructure that powers the AI economy.
As Eliyan moves toward its 2026 shipment goal, the industry will be watching for signs of early adoption by top-tier semiconductor firms. The capital raised in this round will likely be deployed to accelerate R&D efforts and expand the company’s engineering headcount in Silicon Valley. With the backing of major institutional and strategic investors, the company is now positioned as a primary challenger in the high-stakes race to define how data moves in the age of artificial intelligence.
Sources
Written by
The Company Wire Staff
Reporting from The Company Wire newsroom. Staff bylines cover funding rounds, product launches and company news verified against primary sources.



